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Technologies: |
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Single
sided, double sided (rigid)
Multi-layer up to 32 layers (rigid)
Blind and buried vias
Controlled impedance
Controlled depth drilling
HDI technology; TDR testing
E-test fixture and Flying probe test
SMOBC
Electro-less Nickel/gold; White Tin; Silver
OSP, HASL, and Leadfree HASL surface finishes
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Manufacturing Specifications: |
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IPC-600 Class 2
IPC-600 Class 3
IPC-6012/ MIL-PRF-31032 |
Standard manufacturing specificationsAvailable
as requiredAvailable
as required with in-house testing capabilities |
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Materials Used:
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FR4 (Normal
or High Tg); FR-5; Isola; CEM-1; CEM-3; Getek; Polyimide;
Teflon (high frequency);
Microwave/high frequency (Rogers 4003 type) Cyanate ester;
Ceramic filled dielectrics; Mixed dielectric constructions available as required; |
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Imaging: |
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Inner layer pads
Smallest finished via
Standard pad size (.002"/ 0.051mm annular ring)
Smallest pad size (.001" / 0.025mm annular ring)
Standard line and spacing
Special line and spacing |
.025" / 0.635mm oversize minimum
.004" / 0.102mm
.0085" / 0.216mm annular ring (.017" / 0.432mm oversize)
.0075" / 0.191mm annular ring (.015" / 0.038mm oversize)
.005" / .005" (0.127mm / 0.127mm)
.003" / .003" (0.076mm / 0.076mm) |
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Drilling: |
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Plated holes, standard tolerance
Non-plated holes
Recommended Aspect Ratio
Special Aspect Ratio
Blind via typical size
Blind via aspect ratio |
± .003" (± 0.076mm)
± .002" (± 0.051mm)
5:1(drill diameter: material thickness)
10:1
.004" - .012" (0.102mm - 0.305mm) finished
0.5:1 (drill depth: drill diameter) |
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Multi-layer Pressing: |
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Customer designs built with symmetric construction is preferred. |
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Inner layer core thickness
Lamination
Panel size |
.002" - .062" (0.051mm - 1.575mm)
Vacuum/pressure
18" x 24" (457.2mm x 609.6mm) |
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Plating: |
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Minimum copper plating in holes
Solder coat over bare copper
White tin
Silver
Electroless nickel/gold
Tab gold |
.001" (25 µm)
Coverage and solderable per J-STD-003
.000015" - .000035" (0.38 - 0.89 µm) tin
.000003" - .000008" (0.076 - 0.203 µm) silver
.000003" - .000010" (0.076 - 0.254 µm) gold
.000025" - .000030" (0.635 - 0.762 µm) gold |
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Solder mask/Carbon Inks: |
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Standard LPI
Minimum LPI
Solder mask "dam" between SM pads
Ink types
Colors
Thermal and UV inks
Plugged vias
Carbon Ink |
.005" / 0.127mm annular ring (.010" / 0.254mm oversize)
.0025"/ 0.0635mm annular ring (.005"/0.127mm oversize)
.004" / 0.102mm minimum
Matte, gloss, semi-gloss
Green (standard), other colors as required
Available as required
Available if necessary
30 ohms per square |
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Silkscreen: |
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Ink types
Colors |
Thermal and UV
White (standard), most other colors available as required |
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Routing: |
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Tolerance |
± .005" / ± 0.127mm |
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Scoring: |
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Web range
Web tolerance
Web angle
Jump (skip) score |
.012" - .020" / 0.305mm - 0.508mm
± .003" / ± 0.076mm
30 degrees, other angles available as required
Available as required |
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Testing: |
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Single/Double side access testing
Flying probe |
Up to 17.5" x 11.0" (444.5mm x 279.4mm) test area
18.0" x 24.0" (457.2mm x 609.6mm) test area |
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Cleanliness: |
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Ionic cleanliness |
.2 µgrams Cl/in2 per IPC-TM-650 (2.3.28) |
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Chemical Testing and Analysis (in-house): |
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Cross sections
Thermal stress analysis
Solderability
Hi-Pot testing
X-ray fluorescence
Ultraviolet and visible spectroscopy
Metallurgical analysis
Backlight analysis
Multi-layer delamination analysis
Waste treatment analysis
Coupon testing (including Group A)
NIST traceable
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Value Added Services: |
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The following FREE services are provided for ALL customers on ALL new jobs: |
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Automated design review check (DRC) Genesis 2000 software
Engineering review
Chemical engineering review and testing
Micro-section, ionic cleanliness and other surface contaminant analysis
Vacuum packaged with dessicant |
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Data Types and File Formats Supported: |
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Gerber
Autocad
Hewlett-Packard
Excellon
International graphics
Genesis
Mentor Neutral
IPC-D-356A
Manual tape ups |
.gbr (274X preferred, 274D supported)
.dwg, .dxf
.hpgl
.drl
.iges
ODB++
.mnfv*
.ipc
Scanning conversions to .gbr available as required |
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Data Transmission: |
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Disk 3.5" floppy or CD ROM
FTP:
e-mail: info@prodigyelectronics.com |
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Certifications: |
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UL-94-V-0 listed; ISO9002; QS9000; TL9000 |
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Technology Roadmap: |
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Laser drilling; Laser direct imaging; Advanced HDI technology; Buried passives
SEM/EDS - Scanning Electron Microscope/Energy Dispersion Scanning |
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